職責(zé)描述：
1.Responsible for Assembly & Packaging development, qualification & NPI.
2.Lead new product development E2E from development phase through qualification and production ramp where the scope consists of packaging, assembly and bumping.
3.Design new packaging methodologies to meet business/customer requirements
4.Responsible for design for manufacturing (DFM) for the success of customer products.
5.Research the packaging materials, responsible for characterization, application and selection.
6.Work with Assembly Engineering to develop the equipment technology along with the package roadmap
7.Drive and work with Assembly Engineering and suppliers for yield improvement during NPI stage
8.Familiar with the quality and reliability test conditions and specifications.
9.Support critical customer issues, including investigation, experiment, simulations, etc.

任職要求：
-Education: Bachelor degree or above
-Language: Excellent oral and written skills in English and Mandarin
-Experience:
6~8years’ work experience including 3~5 years’ process expertise experience in a high paced environment
1.Project Management
2.Good understanding of Semiconductor processes.
3.Strong problem solving skills and ability to handle multiple projects concurrently.
4.Experience and knowledgeable in substrate manufacturing process and wafer bumping is preferred.
5.Knowledge on Six Sigma and Lean, BB preferred.

蘇州通富超威半導(dǎo)體有限公司(TF-AMD）簡(jiǎn)介
1、超威半導(dǎo)體（AMD）簡(jiǎn)介：
AMD公司成立于1969 年，總部位于美國(guó)加利福尼亞州桑尼維爾。AMD（NYSE: AMD）是一家創(chuàng)新的科技公司，致力于與客戶及合作伙伴緊密合作，開發(fā)下一代面向商用、家用和游戲領(lǐng)域的計(jì)算和圖形處理解決方案。.AMD的業(yè)務(wù)遍布全球，擁有約為12000名員工。
2、通富微電子股份有限公司簡(jiǎn)介：
1997年10月成立，股票簡(jiǎn)稱：通富微電，股票代碼：002156。
公司總部位于中國(guó)江蘇省南通市，旗下企業(yè)包括通富微電、南通通富、合肥通富、通富超威（蘇州）和通富超威（檳城）等五大封測(cè)企業(yè)。公司是中國(guó)本土前三大集成電路封裝測(cè)試企業(yè)，全球前十大半導(dǎo)體制造商一半以上是通富微電的客戶。公司擁有國(guó)家認(rèn)定企業(yè)技術(shù)中心、國(guó)家博士后科研工作站、江蘇省企業(yè)院士工作站、省級(jí)工程技術(shù)研究中心和企業(yè)研究院等高層次研發(fā)平臺(tái)。
3、蘇州通富超威半導(dǎo)體有限公司（TF-AMD）
公司位于中國(guó)蘇州工業(yè)園區(qū)蘇桐路88號(hào)，由通富微電子股份有限公司（通富微電）作為控股股東與美國(guó)超威半導(dǎo)體（AMD）共同合資成立。公司主要從事高端處理器芯片封裝測(cè)試業(yè)務(wù)，滿足從處理器半成品切割、組裝、測(cè)試、打標(biāo)、封裝的五大CPU后期制造流程，同時(shí)具備對(duì)中央處理器（CPU）、圖形處理器（GPU）以及加速處理器（APU）進(jìn)行封裝和測(cè)試能力，是通富微電旗下五大封測(cè)基地之一。
誠(chéng)摯邀請(qǐng)您加盟本公司，我們堅(jiān)信能為員工提供具有競(jìng)爭(zhēng)力的薪酬/福利和系統(tǒng)的培訓(xùn)機(jī)會(huì)（海外/本地）,以及廣闊的職業(yè)發(fā)展前景。